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Semiconductor-related Products | Semiconductor Packaging Materials, Coreless FC-BGA Substrates

Coreless FC-BGA substrate consists of build-up layers only. Since it does not contain core layer, it is characterized by high-density and ultra- thin with superior electric property.
Improved degree of freedom in design is also achieved.

Coreless FC-BGA Substrates

Structure

Structure

Features

Small Substrate Thickness

Total thickness of coreless substrate is about 1/2 of the standard build-up substrate.

Small Substrate Thickness

High-speed Data Transmission

Coreless substrate shows better performance than build-up type at a frequency range above 20 GHz.

High-speed Data Transmission

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