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Semiconductor Packaging Materials | Semiconductor-related Products, FC-BGA substrates

Packaging substrates for flip chip (FC) with multi-pin, high-density functions required in ASICs, CPUs, and GPUs.
Supports lead- and halogen-free mounted packaging substrates.

FC-BGA substrates

Structure

Structure

Applications

  • Microprocessors(CPU)
  • Graphic processors(GPU)
  • Peripheral chip set
  • Game-type CPUs and GPUs
  • Applications processors
  • Digital Signal processors(DSP)
  • Baseband processors

Product Lineup

Product Lineup

Technology Roadmap (Mass Production Basis)

Technology Roadmap (Mass Production Basis)

Features

●High-density

High-order build-up

High-order build-up

  • Line / Space = 12 / 12μm
  • Land / Via = 85 / 55μm

Full-stack via

Full-stack via

  • Land / Via = 80 / 50μm

Solder Resist Planarization

Solder Resist Planarization

  • Stabilization of Opening Size
  • Uniformity of Opening Shape

Fine pich Core

Fine pitch Core

  • Land / Through Hole Dia. = 205 / 105μm

●Narrow Pitch FC Bumps

FC Bump

FC Bump

  • Pitch = 150μm

FC Bump

FC Bump

  • Pitch = 120μm

●Higher Pin Count / Ultra Fine Line

Fine-Pitch Patterns (Semi-Additive process) 1

Fine-Pitch Patterns (Semi-Additive process) 2

Fine-Pitch Patterns (Semi-Additive process)

  • Line / Space = 10 / 10μm

Fine-Pitch Patterns (Subtractive process) 1

Fine-Pitch Patterns (Subtractive process) 2

Fine-Pitch Patterns (Subtractive process)

  • Line / Space = 30 / 30μm

●Enhanced Electrical Performance

Through holes for thin cores and fields

Through holes for thin cores and fields

Environment-friendly performance

Halogen-free Products

  • Halogen-free solutions are the best application for environment-friendly products.
  • The level of long-time reliability (heat/moisture resistance and deterioration characteristic) is the same as that of the conventional products.
  • *Halogenated flame retardants are considered to tend to generate emissions of dioxin when combusted.

■Combustion Gas Analysis (at 750℃, for 10min.)

Combustion Gas Analysis (at 750℃, for 10min.)

Lead-free solder Coat

  • Lead-free solutions are the best application for environment-friendly products.
  • The level of solderability and long-time reliability (heat/moisture resistance and deterioration characteristic) is the same as those of the conventional products.
  • *Lead lowers the melting point very effectively, but toxic substances may be transferred to soil after the disposal.

Lead-free solder Coat figure

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