Top of page
Content Area

Semiconductor-related Products, Semiconductor Packaging Materials

Semiconductor packaging materials play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards.

Demand for high-speed, high-integration and low power consumption of ICs accompanying the rapid progress of electronics technology such as AI, Cloud computing, Intelligentization of automobiles, and due to the miniaturization and thinning of electronic devices typified by smart phone and wearable devices, semiconductor packages are required further high density, multilayer, low-profile. Toppan has been developing and manufacturing various types of semiconductor packaging materials including leadframes, and FC-BGA substrates by utilizing the cutting-edge photolithography and etching technology, Toppan's long-established advantages.

Semiconductor Packaging Materials

Line- up and Structure of Products

Toppan offers several types of semiconductor package-related products.

Lead frame

FC-BGA substrate

Progress of Semiconductor Packages

Semiconductor packages require 3 points: 1. smaller packaging with high density; 2. high pin-count for high integration with multiple functions; 3. high heat-dissipation characteristics and high electric properties enabling high performance. Toppan offers wide range of products required by constantly evolving needs in the semiconductor packaging market.

Progress of Semiconductor Packages

Footer Area


Copyright © 2019 TOPPAN PRINTING CO., LTD. All Rights Reserved.