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Semiconductor-related Products, Semiconductor Packaging Materials

Semiconductor packaging materials play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards.

There has been a trend of rapid development of mobile devices including mobile phones, digital consumer products, and other various types of memory media. This trend has contributed to accelerate to speed up and highly integrate circuit functions, and tighten the spec requiring further smaller, lighter and thinner packaging materials. Toppan has been developing and manufacturing various types of semiconductor packaging materials including leadframes, and FC-BGA substrates by utilizing the cutting-edge photolithography and etching technology, Toppan's long-established advantages.

Semiconductor Packaging Materials

Line- up and Structure of Products

Toppan offers several types of semiconductor package-related products.

Lead frame, FC-BGA substrate Lead frame FC-BGA substrate

Progress of Semiconductor Packages

Semiconductor packages require 3 points: 1. smaller packaging with high density; 2. high pin-count for high integration with multiple functions; 3. high heat-dissipation characteristics and high electric properties enabling high performance. Toppan offers wide range of products required by constantly evolving needs in the semiconductor packaging market.

Progress of Semiconductor Packages

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