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Semiconductor-related Products | Photo Etched Parts  Specification outline

Metal Etching Products

Etching size

500mm×600mm(at Maximum)

Material thickness

0.010mm(at Minimum), 0.300mm(at Maximum)

Delivery form

Roll or Sheet

Type of metal

Cu, SUS, 42Alloy, Al, Inver, etc.

Manufacturing process


Special processing

Bonding of flames, Surface treatment, etc.

  • With thin metal base material, utilizing through hole technology or half etching technology.
  • Delivery form could be either roll or sheet.
  • No deformation, such as burrs, bend, or warp on the base material; high precision manufacturing is possible.
  • Capable of wide range of secondary processes.


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