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Semiconductor-related Products | Photo Etched Parts  Specification outline

Metal Etching Products

Etching size

500mm×600mm(at Maximum)

Material thickness

0.010mm(at Minimum), 0.300mm(at Maximum)

Delivery form

Roll or Sheet

Type of metal

Cu, SUS, 42Alloy, Al, Inver, etc.

Manufacturing process

Photolithography

Special processing

Bonding of flames, Surface treatment, etc.

  • With thin metal base material, utilizing through hole technology or half etching technology.
  • Delivery form could be either roll or sheet.
  • No deformation, such as burrs, bend, or warp on the base material; high precision manufacturing is possible.
  • Capable of wide range of secondary processes.
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