FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.
We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.
For a growing demand for LSIs for automotive SoC or high-end processors (server, AI, network) as well as for PCs or game devices, we provide comprehensive support from substrate design to production.
Solutions for lead-free and halogen-free products are also available.
Drill holes in the core material and plate it with copper. Then remove the copper except for a circuit pattern area.
Expose a circuit pattern to directly form circuit with copper plating. Repeat this treatment and laminate (build up)
After applying solder resist, place solder bumps where LSI chips (die) will be mounted. After cutting into each pieces, inspect appearance and electric characteristics.
＊Core plating thickness10um
※ Please contact us individually about the materials for prototyping/evaluation.