Please refer to this page for detailed information on products.

•Photomasks for semiconductors•Design services for LSI•Device OEM•Leadframes•BGA/CSP substrates•Color filter arrays for image sensors and small display devices•Etched products•Printed circuit boards

Electronic devices like mobile phones, digital cameras, and game machines are growing smaller and offering increasingly high performance, and simultaneously ratcheting up demands for greater speed, multi-functionality, and lower power consumption in semiconductors and other electronics parts. Toppan is contributing to the global electronics industry by using its industry-leading technical capabilities and global manufacturing network to develop businesses in photomasks, which are essential for creating circuit patterns on silicon wafers in the front-end manufacturing of semiconductors,leadframes and other package-related products used in back-end manufacturing (packaging process), and circuit boards.
We are constantly at the forefront in semiconductor photomasks,serving volume production needs for 45 nm and 32/28 nm circuits (1 nm = 1 millionth of a millimeter) and moving forward with technical development efforts anticipating the coming of 22 nm circuits.
In products for semiconductor packages, we respond to diverse semiconductor manufacturer needs by developing and manufacturing various types of leadframes, tape BGA/CSP•FC-BGA substrates, and other products.
Meanwhile, in the area of printed circuit boards, we have exercised cutting-edge development, manufacturing, design,simulation, and analysis capabilities to develop products like a highly integrated, multilayer circuit board with ultrafine circuits and a high aspect ratio, and boards with built-in parts for improved on-board space efficiency and electrical characteristics.
Adding to the above, we are engaged in a wide variety of other businesses, like device OEM services and the production of various types of products. The former span all processes from semiconductor circuit design through prototyping,evaluation, and volume production. The latter include an on-chip color filter for image sensors, and other products that take advantage of our silicon wafer processing and etching technologies.